Sep 4th, 2018
Hybrid construction is a huge growth area with a lot of opportunity for PCB designers. Learn from Chris Hunrath, VP of Technology at Insulectro, as he provides several valuable insights about the latest in hybrid construction trends. Get facts from an expert in material properties and how to use and combine them in the PCB assembly process. Learn more about polyamide film and its properties, how to use the FR4 as glue, and many more ways to make hybrid construction more familiar and approachable. Join us in this week’s OnTrack Podcast where we bring insights from the manufacturing floor to PCB design teams around the world.
- Chris will be a speaker at AltiumLive in October, so be sure not to miss him there, the title of his talk will be announced very shortly
- Chris sheds more light on the topic of inductance and plane inductance which was recently discussed by Rick Hartley in our Podcast: What to Avoid in 4 and 6-Layer Stack-ups
- Embedded capacitors: one of the things that you don't get from embedded capacitor material or planner capacitor materials, is high capacitance, so an individual component will give you a relatively high capacitance level
- There is a capacitance shortage right now too
- Also, there’s a desire to remove surface capacitors for several reasons. You get rid of the vias, you get rid of the inductance and increase the circuit density
- Even when capacitance per square inch is small you don't need as high a capacitance, because you're getting rid of a lot of the in-plane inductance and that's exactly what Rick talked about in his podcast
- Nowadays, with thinner materials, Rick’s recommendation makes sense
- Polyamide film, typically used for flex circuits can be used in a rigid board because it has a thin dielectric layer and has a very high dialect for standing voltage and you can make it really thin
- You can build it into a rigid board and get the properties you need to get rid of those capacitors which leads into hybrid construction, how do you process them?
- The building blocks used to make flex circuits. If you're using an Acrylic which we talked about in a previous podcast laminates its standard FR4 temperatures. True Polyamide films laminate at much higher temperatures like 600° F.
- You can't expose FR4 to those temperatures so in the case of very high capacitance materials you would use the FR4 as the glue and you would just use the core as its print match it, bond treat it and then build it into your FR4 part
- You can’t mix B-stages in the same spot when you laminate that all together the FR4 would be broken down
- Materials on the High Speed Digital side should also have the RF properties and you want to be able to mix those materials so it's becoming very popular
- Hybrid Constructions - a growth area - it’s become like gourmet cooking - there is new media to work with - a material science based area
- Components typically added to outside of PCB are now being embedded inside the PCB
- Solder paste reflow and interconnects can be a downside
- The new materials allow you to do things you couldn’t do before.
- Coins can be used to add inductance if you need to just for heat sinking purposes.
- Bleeding printed electronic technology into PCBs: DuPont have a very interesting liquid polyamide technology that cures at 300° Fahrenheit which is very low and we're exploring the opportunity to use that in lieu of solder mask. It would just be screened on.
- If someone needs information on Hybrid Constructions or sintering paste, please email Chris.
Links and Resources:
Listen to Chris Hunrath’s previous episodes:
View all show notes and VIDEO here.