UA-40175800-1 Seamless Global Transfer with Julie Ellis from TTM
00:0000:00

See all the show notes here

Julie Ellis started her career as a representative for a semiconductor manufacturer after completing her Bachelor’s in Electrical Engineering. Now she is a Field Applications Engineer (FAE) at TTM Technologies, the third-largest circuit board manufacturer in the world. Listen to Julie and Judy discuss seamless global transfer and recommendations on working with offshore fabricators. Learn how to avoid excessive technical queries and how to migrate from prototype to production while optimizing global processes.

Bonus update on AltiumLive: Julie and Carl Schattke will be presenting at AltiumLive 2018, introducing new stackup and impedance tools in Altium Designer 19, so be sure not to miss them!

Show Highlights:

  • Julie Ellis did a presentation about Documentation at AltiumLive 2017.
  • What is Seamless Global Transfer? Transferring PCB manufacturing from onshore prototype level into production and offshore.
  • Julie started her career at Hughes Aircraft, where she completed her Electrical Engineering Bachelor Degree - best decision of her life
  • More women (not just circuit board barbie) need to get into STEM!  #WomenInTech. Julie always encourages young women who are interested in STEM, to get a degree that will enable them to move into fascinating jobs with a variety of opportunities.
  • Julie’s first job was as a semiconductor manufacturer’s representative; realized she liked the circuit board side of the business more than ICs and migrated over.
  • On TTM: It’s like working at Google for circuit boards, I can always call someone for answers about manufacturing best practices.
  • Seamless global transfer - the concept is that you aren’t just designing for the prototype but for global manufacturing i.e. avoid 100 technical queries
  • What makes migrating over such a difficult process? Because the 6-Sigma 6Ms, are not the same when it transfers over to Asia.
  • What are the 6Ms?  Method, Mother Nature “Environmental”, (Man) People, Measurement, Machine, Materials.
  • Equipment sets are different for mass production, production lines are longer, there is not as much human oversight, production lines must be scheduled and you cannot stop/start the process. The tolerances are different and they need to be accomodated in the designs.
  • Throughput and drilling is always a bottleneck and to reduce this and reduce turn time, mass production sites have tweaked processes to get the highest yield.
  • Internationally the general rule is 4 mil lines and spaces on half ounce copper; 10 mil is the most common size drill which results in an 8 mil finish hole size.
  • As you go up in copper thickness you need to add a little bit to the pads.
  • Blind vias are the ones that are on the outside but end up on an internal layer.
  • Buried vias are buried completely inside the board.
  • Working with offshore production house while still in prototype development phase.
  • Recommendation - design for volume and technology. Qualify the design for the final production region and technology.
  • HDI (High Density Interconnect) is anything 0.4 mm pitch and under that has a track running through the pads.
  • Judy wants to throw everyone inside a fab house!
  • There are at least 30 different processes required to manufacture one 4-layer board.
  • Julie works directly with Carl Schattke and they will do a stackup presentation at AltiumLive 2018
  • Materials are a significant cost in Asia, whereas here in the states the material is less of a cost (20% in USA, 50% in China).
  • With production panels where you're trying to get as many cookies cut, you also need to consider and discuss with your manufacturer the tiny 2x2 inch pieces.

 

Links and Resources:

AltiumLive 2018: Annual PCB Design Summit

AltiumLive 2017 Presentation

TTM’s Interface Between Designer and Fabricator

TTM Technologies Website

Carl Schattke

 

Share | Download(Loading)