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The PCB Design Podcast features conversations on all facets of PCB Design and Hardware Development
Episodes
Wednesday Sep 21, 2022
Wednesday Sep 21, 2022
In this episode, our guest Joe Dickson, tells us about the cutting-edge technology implemented in advanced packaging at Wus Printed Circuit International.
Show Highlights:
- Joe Dickson talks about what they do at Wus, a printed circuit manufacturing company
- He shares about their efforts to bring PCB technologies farther up by introducing advanced packaging options
- He briefly describes what printed circuit-like materials are, also known as the vertical interposers or PCIe
- Zach explains how a pre-packaged chip can be mounted on a board
- What are the reliability and signal integrity challenges that come with assembling different packages on a board
- Off-the-board solutions start to become more and more desirable
- The flexibility of design and components is what driving the market to use more integrated packaging
- Speed is everything! When will the industry move on from copper and go to optical?
- Knowing what's going on in simulations is very important; it opens opportunities to try new things
- Joe explains a way of using Faraday cages with cable connections on the surface
- Examples of the large market using the PCIe method are Xilinx and NVIDIA
- How far is silicon photonics from becoming mainstream as an interconnect technology?
- Standardazion versus innovation
- The future of PCB assembly is hybrid. Some will use the off-shelf, best-in-class products from Intel, AMB, NVIDIA, Xilinx, and get creative with them.
Links and Resources:
- Connect with Joe Dickson on LinkedIn
- Visit Wus Printed Circuit International website
- Watch the related episode:
- Connect with Zach on LinkedIn
- Full OnTrack Podcast Library
- Altium Website