Listen in to Judy Warner and guest John Andresakis from DowDupont and learn about embedded resistance materials. There are several benefits that make this a beneficial technology. Did you know that you can take up to 90% of your decoupling caps off the surface of the board, while improving reliability and reducing inductance? Learn about several design considerations for using embedded capacitors and build on the knowledge of experts like Rick Hartley and Eric Bogatin who both addressed inductance in their AltiumLive San Diego keynotes.

Watch the video, click HERE.

Show Highlights:

  • Senior Technical Marketing Leader - Interconnect Solutions at DowDupont; 30 years experience mostly on the materials side and now at DowDupont, soon to be the new Dupont.
  • Embedded capacitance -cross connections with: Rick Hartley's keynote at Altiumlive (inductance) and Eric Bogatin's keynote as well
  • This reduces inductance
  • Film based materials now allow embedded capacitor layers to be 1 mil or below with excellent yields
  • People were practicing some form of this 30+ years ago, but according to patents 25 years or so. There used to be material concerns, but with the advanced materials i.e. improvements in technology more is possible.
  • What manufacturers are providing this service? Most of them!
  • It's like a version of a rigid flex, without the flex part sticking out.
  • This isn’t a very hard thing to implement, it wouldn’t be difficult for the manufacturer to get up to speed on this. The things involved are not difficult to learn.
  • Learn more at IPC APEX - stop by DowDuPont and Insulectro - booth 624


Links and Resources:

IPC Standard: 2316 Design Guide for Embedded Passive Device Printed Boards

DuPont Interra HK04J Planar Capacitor Laminate

IPC Standard: 4821 for embedded passive devices

Rick Hartley on the Importance of PC Board Stack-up at AltiumLive

Eric Bogatin on The Value of the White Space at AltiumLive

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