Our guest Phil Marcoux is very well-known in the advanced electronic packaging community and currently working as a business mentor in the electronics industry.
Phil is labeled as the father of SMT by the IPC. He is a Charter member of SMT Council, granted the IPC President's Award, past owner of over 40 integrated circuit packaging and camera module-related patents, and consultant on numerous heterogeneous designs and standards, just to name a few of his excellent achievements.
Today we will tackle the pros and cons of heterogeneous electronic assemblies and what we can do as an industry to move forward with it.
- Learn about Phil Marcoux and his upcoming panel discussion at PCB West
- The panel will discuss “How Heterogeneous Integration Affects the PCB Industry.”
- Phil is looking forward to promoting PCEA and the need to embrace education
- PCB designers must recognize what compromises they will have to make to utilize that chiplet
- One of the challenges is to encourage companies to work together and to agree to a standardized chiplet format
- The funding from the federal government may motivate companies to embrace the heterogeneous type of format and the chiplet format.
- Many defense contractors, military products, and advanced electronic products are now rapidly depending on the need for heterogeneous designs
- Other significant drivers in the market include medical devices, telecommunications, and 5G products
- Most design software are fully capable of handling heterogeneous integration
- PCB designers can very quickly jump in. Many structures in a printed circuit board, especially in HDI designs, are also used in advanced packages.
Links and Resources:
- Follow Phil Marcoux on LinkedIn
- Learn more about PCB West 2022
- Visit PCEA website
- Full OnTrack Podcast Library
- Altium Website