Episodes
Wednesday Nov 01, 2023
The Data Science Renaissance
Wednesday Nov 01, 2023
Wednesday Nov 01, 2023
In this episode of the OnTrack Podcast, our host Zach Peterson sits down with Geoffrey Leeds, the founder of Leeds Engineering and Data Science. If you've ever wondered how production managers react to integrating data science into production operations, or if the term "data-driven decision-making" has piqued your interest, you're in for a treat.
Geoffrey shares his journey from his time at Insulectro to venturing out to help companies embrace data science. The discussion dives deep into the challenges and opportunities of applying data science in manufacturing, with a focus on improving decision-making and efficiency.
In a candid conversation, Geoffrey and Zach explore the misconceptions and hurdles faced by production managers when introduced to the world of data science. From the fear of complexity to concerns about cost and implementation, they tackle the real-world issues that arise when trying to bridge the gap between manufacturing and data science.
Whether you're a seasoned professional in the field or just starting to explore the possibilities of data-driven decision-making, this episode offers valuable insights and perspectives. Join Geoffrey Leeds and Zach Peterson as they navigate the intersections of manufacturing, data science, and the exciting potential for innovation in the industry.
Don't miss out on this engaging and informative episode of the Altium OnTrack podcast! Subscribe now and stay tuned for more discussions with industry leaders and innovators.
Show Highlights:
- Intro
- Return of Data Science
- Bad Data & Improper Recommendations
- Automated Process Solutions
- Capturing Data
- IIoT
- Onshoring & the Winds of Change
- A Plethora of Processes
- PCB Packaging
- 49:25 Manufacturing is Fun & Challenging Again
- 52:42 New Data Solutions
Wednesday Sep 28, 2022
Pros and Cons of Advanced Electronic Packaging for PCB Designers
Wednesday Sep 28, 2022
Wednesday Sep 28, 2022
Our guest Phil Marcoux is very well-known in the advanced electronic packaging community and currently working as a business mentor in the electronics industry.
Phil is labeled as the father of SMT by the IPC. He is a Charter member of SMT Council, granted the IPC President's Award, past owner of over 40 integrated circuit packaging and camera module-related patents, and consultant on numerous heterogeneous designs and standards, just to name a few of his excellent achievements.
Today we will tackle the pros and cons of heterogeneous electronic assemblies and what we can do as an industry to move forward with it.
Show Highlights:
- Learn about Phil Marcoux and his upcoming panel discussion at PCB West
- The panel will discuss “How Heterogeneous Integration Affects the PCB Industry.”
- Phil is looking forward to promoting PCEA and the need to embrace education
- PCB designers must recognize what compromises they will have to make to utilize that chiplet
- One of the challenges is to encourage companies to work together and to agree to a standardized chiplet format
- The funding from the federal government may motivate companies to embrace the heterogeneous type of format and the chiplet format.
- Many defense contractors, military products, and advanced electronic products are now rapidly depending on the need for heterogeneous designs
- Other significant drivers in the market include medical devices, telecommunications, and 5G products
- Most design software are fully capable of handling heterogeneous integration
- PCB designers can very quickly jump in. Many structures in a printed circuit board, especially in HDI designs, are also used in advanced packages.
Links and Resources:
- Follow Phil Marcoux on LinkedIn
- Learn more about PCB West 2022
- Visit PCEA website
- Full OnTrack Podcast Library
- Altium Website
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Wednesday Sep 21, 2022
Cutting Edge Technology in Packaging with an Interposer
Wednesday Sep 21, 2022
Wednesday Sep 21, 2022
In this episode, our guest Joe Dickson, tells us about the cutting-edge technology implemented in advanced packaging at Wus Printed Circuit International.
Show Highlights:
- Joe Dickson talks about what they do at Wus, a printed circuit manufacturing company
- He shares about their efforts to bring PCB technologies farther up by introducing advanced packaging options
- He briefly describes what printed circuit-like materials are, also known as the vertical interposers or PCIe
- Zach explains how a pre-packaged chip can be mounted on a board
- What are the reliability and signal integrity challenges that come with assembling different packages on a board
- Off-the-board solutions start to become more and more desirable
- The flexibility of design and components is what driving the market to use more integrated packaging
- Speed is everything! When will the industry move on from copper and go to optical?
- Knowing what's going on in simulations is very important; it opens opportunities to try new things
- Joe explains a way of using Faraday cages with cable connections on the surface
- Examples of the large market using the PCIe method are Xilinx and NVIDIA
- How far is silicon photonics from becoming mainstream as an interconnect technology?
- Standardazion versus innovation
- The future of PCB assembly is hybrid. Some will use the off-shelf, best-in-class products from Intel, AMB, NVIDIA, Xilinx, and get creative with them.
Links and Resources:
- Connect with Joe Dickson on LinkedIn
- Visit Wus Printed Circuit International website
- Watch the related episode:
- Connect with Zach on LinkedIn
- Full OnTrack Podcast Library
- Altium Website